Xiamen Joiny Electronics Co., Ltd.

Product Description

High Thermal Conductivity Silicone Pad is an interface material used for thermal management of electronic devices. It is mainly composed of a silicone matrix and thermally conductive fillers and is in the form of soft sheets. It is designed to fill the tiny gaps between electronic components and heat sinks, reduce thermal resistance, and improve thermal conduction efficiency. The thermally conductive fillers of this material usually include aluminum oxide, aluminum nitride, silicon nitride, etc. to improve thermal conductivity; the matrix material is mostly silicone, which provides good flexibility and adaptability. In liquid form, the thermally conductive silicone pad can self-level during assembly, fill irregular or complex gaps, and form an elastomer after curing to maintain long-term stable thermal conductivity. Thermally conductive silicone pads are widely used in electronic devices that require efficient heat dissipation, such as LED lighting, computer motherboards, power modules, etc.

Features

High thermal conductivity retention rate under thermal stability
High Thermal Conductivity Silicone Pad is made of high-temperature resistant silicon-based polymer and thermal conductive filler. Under continuous working conditions above 150°C, its thermal conductivity change rate is less than 5%. This feature is obtained through high-temperature aging tests, showing that the material can still maintain its original thermal conductivity under long-term high-temperature operating conditions. This thermal conductivity stability is particularly critical for scenarios that are sensitive to thermal runaway (such as power battery packs and LED driver modules), and can significantly reduce the reliability risks caused by thermal degradation.

Strong stress buffering ability
This type of silicone pad not only has thermal conductivity, but also has a certain stress buffering effect. Because its material system has a low Young's modulus and high flexibility, it can absorb the stress concentration caused by microstructural deformation when subjected to mechanical vibration, thermal expansion and contraction, and assembly errors, and reduce the probability of damage to solder joints and contact surfaces. Although its tensile strength is 8 psi, its deformation is controllable and has strong recoverability, which is suitable for occasions with frequent thermal cycles or mechanical shocks, such as vehicle controllers and power modules.

Possessing low thermal contact resistance
In practical applications, the efficiency of heat conduction depends not only on the thermal conductivity of the material, but more importantly on the thermal contact resistance formed with the surface of the heat source. High Thermal Conductivity Silicone Pad has good surface adaptability (Shore 00 hardness 55±5), and can form an effective contact interface under appropriate pressure (about 20~50 psi). Its thermal contact resistance can be controlled at 0.1~0.3 °C·cm²/W (typical value), which has higher thermal coupling efficiency than some high-hardness thermal conductive materials and reduces interface thermal mismatch.

Supports automated mounting
This type of thermal conductive silicone pad has processing characteristics such as high dimensional stability, no edge warping, and strong tear resistance. It is compatible with high-speed mounting equipment and is suitable for standardized operation in SMT automatic lines and module assembly lines. In addition, the material is not easy to produce silicone oil leakage, avoiding contamination of precision components such as lenses and sensors. In multi-layer module structures, automatic stacking can be achieved, improving production efficiency and reducing manual intervention.

* High thermal conductivity module
* New energy vehicles
* Microprocessors, memory chips and graphics processors
* Network communication equipment
* Car equipment, charger
* High-speed hard disk drive

Packaging of thermal pad/ conductive pad / thermal interface pad Carton boxes size:270mm(L)*170mm(W)*40mm(H)
Packaging Details: The normal package is carton box, if export quantities are too much, we will put the carton boxes on the planker, and then pack the whole planker up to transport. Port: Xiamen
 

Established in 2004, Xiamen JOINY Electronics Co., Ltd.is a high-tech enterprise which dedicates to develop, produce thermal conductive materials, and to provide thermal management solutions as well.
We are committed to meeting customer needs by delivering high-quality products and providing fast and flexible services to maximize customer value. Through our dedication, we have established strong partnerships with major new energy vehicle manufacturers, telecommunications companies, leading smartphone brands, and professional equipment manufacturers worldwide, enabling us to serve customers globally.

https://www.xmjoiny.com/